Process of removing residue material from a precision surface

US6890855B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• John M. Cotte · New Fairfield, US
• Kenneth McCullough · Fishkill, US
• Wayne M. Moreau · Wappingers Falls, US
• Keith R. Pope · Danbury, US
• John P. Simons · Cold Spring, US
• Charles J. Taft · Wappingers Falls, US

Key dates

• Filing date: Jun 27, 2001
• Grant date: May 10, 2005
• Expiry date: Jul 22, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02057
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A process of removing residue from an etched precision surface. In this process the etched precision surface is contacted with a composition which includes liquid or supercritical carbon dioxide and a fluoride-generating species.