Electronic device having a stack of semiconductor chips and method for the production thereof

US6894381B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Wolfgang Hetzel · Nattheim, DE
• Anton Legen · Munich, DE
• Jochen Thomas · Munich, DE

Key dates

• Filing date: Dec 17, 2003
• Grant date: May 17, 2005
• Expiry date: Dec 17, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to an electronic device having a stack of semiconductor chips, and to a method for the production thereof. A first semiconductor chip is arranged on a rewiring substrate, and at least one semiconductor stack chip is arranged on the first semiconductor chip. A rewiring plane is arranged between the semiconductor chips. The contact areas of the semiconductor chips are connected to external contacts of the device by the rewiring plane and the rewiring substrate.