Semiconductor device and method of manufacturing same
US6897570B2 · kind B2 · utility
29Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2003 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Jan 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A highly reliable semiconductor device provided herein can prevent a junction between a pad and a wire from coming off, and pads from peeling off an underlying insulating layer on the interface thereof. The semiconductor device has plugs formed in a region in which an electrode pad is formed over a substrate. The plugs protrude into the electrode pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.