Method for testing wafers to be tested and calibration apparatus

US6897646B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thomas Grebner · Freising, DE
• Hans-Christoph Ostendorf · Munich, DE
• Michael Schittenhelm · Poing, DE
• Erwin Thalmann · Birkenfeld, DE

Key dates

• Filing date: Aug 22, 2002
• Grant date: May 24, 2005
• Expiry date: Oct 30, 2022

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2831
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

The invention provides a method for testing wafers (101) to be tested in a test device (100), in which the test device (100) can be calibrated, at least one calibration wafer (102) being automatically introduced into the test device (100) by means of a handling unit (103), calibration values of the test device (100) being determined by means of a control by a calibration sequence control unit (105), the calibration values determined being stored in a memory unit (106), the test device (100) being calibrated by means of the stored calibration values, the calibration wafer (102) being output from the calibrated test device (100), and at least one wafer (101) to be tested being introduced into the calibrated test device (100) by means of the handling unit (103) and being tested by a control by means of a test sequence control unit (104) in the calibrated test device (100), the stored calibration values being applied.