Apparatus for detecting CMP endpoint in acidic slurries
US6899784B1 · kind B1 · utility
6Cited by
6References
8Claims
0Family size
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Key dates
| Filing date | Jun 27, 2002 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Sep 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for measuring ammonia gas concentration in an ongoing chemical mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.