Lead-frame method and assembly for interconnecting circuits within a circuit module

US6900527B1 · kind B1 · utility

Assignee

• Amkor Technology, Inc. · US

Inventors

• Jeffrey Alan Miks · Chandler, US
• Kenneth Kaskoun · Berlin, DE
• Markus K. Liebhard · Gilbert, US
• Donald C. Foster · Lake Forest Park, US
• Paul R. Hoffman · Exton, US
• Frederic Bertholio · Molsheim, FR

Key dates

• Filing date: Sep 19, 2001
• Grant date: May 31, 2005
• Expiry date: Sep 19, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.