Packaging microelectromechanical structures
US6903452B2 · kind B2 · utility
74Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2003 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Aug 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microelectromechanical system may be enclosed in a hermetic cavity defined by joined, first and second semiconductor structures. The joined structures may be sealed by a solder sealing ring, which extends completely around the cavity. One of the semiconductor structures may have the system formed thereon and an open area may be formed underneath said system. That open area may be formed from the underside of the structure and may be closed by covering with a suitable film in one embodiment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.