Method and apparatus for cleaning substrates

US6908865B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Martin Kranz · Radeberg, DE
• Srinivas Guggilla · San Jose, US
• Suraj Rengarajan · Sunnyvale, US
• Mei Chang · San Jose, US
• Gongda Yao · Fremont, US
• Nitin Khurana · Santa Clara, US
• Gilbert Hausmann · Felton, US

Key dates

• Filing date: Dec 12, 2001
• Grant date: Jun 21, 2005
• Expiry date: May 10, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/3355
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Generally, a method for pre-cleaning native oxides and other contaminants from apertures on a substrate is provided. In one embodiment, a method for pre-cleaning apertures on a substrate includes disposing the substrate on a support member in a process chamber, cooling the substrate at least to a temperature of 100 degrees Celsius, and exposing the substrate to a pre-clean process. In another embodiment, a method for pre-cleaning apertures on a substrate includes cooling the substrate at least to a temperature of 100 degrees Celsius in a first chamber, transferring the substrate to a second chamber and pre-cleaning the substrate in the second chamber while maintaining a substrate temperature of 100 degrees Celsius.