Apparatus for plasma processing
US6910440B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 18, 2001 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Jan 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32256
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus that generates a uniform plasma, thus allowing uniform processing of large-diameter wafers. The cylindrical apparatus includes a wafer mounting table, a silica plate providing an airtight seal, a microwave supplier for propagating a microwave in TE11 mode, and a cylindrical waveguide connected at one end to the microwave supplier. A radial waveguide box is connected between the other end of the cylindrical waveguide and the silica plate. The radial waveguide box extends radially outward from the cylindrical waveguide, forming a flange and defining an interior waveguide space. A disc-shaped slot antenna is located at the lower end of the radial waveguide box, above the silica plate. A circularly-polarized wave converter disposed in the cylindrical waveguide rotates the TE11-mode microwave about the axis of the cylindrical waveguide, and sends the rotating microwave to the radial waveguide box.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.