Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
US6911127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2003 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Jan 28, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/06
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path. The contact members can comprise electrically conductive biasing elements, such as fingers, that have a contact site and a dielectric coating covering at least a portion of the biasing elements. The c…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.