Bonding pads of printed circuit board capable of holding solder balls securely
US6911604B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2002 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Sep 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0594
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board, which comprises a substrate, a conductive pattern disposed on a surface of said substrate and a solder mask coated on the surface of said substrate and covered over the conductive pattern. The conductive pattern has a bonding pad. The solder mask has an opening corresponding in location to the bonding pad such that a portion of the bonding pad is exposed outside. A space is left between said solder mask and said bonding pad and is communicated with the opening. Whereby, a solder ball can be received in the opening and the space and electrically connected to the bonding pad, such that the solder ball is held on the printed circuit board securely.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.