Wafer metrology apparatus and method

US6919958B2 · kind B2 · utility

Assignee

• Therma-Wave, Inc. · US

Inventors

• Fred E. Stanke · Cupertino, US
• Clinton Carlisle · Palo Alto, US
• Hung Pham · San Jose, US
• Edric Tong · Sunnyvale, US
• Douglas E. Ruth · Sunnyvale, US
• James Cahill · San Jose, US
• Michael Weber-Grabau · Sunnyvale, US
• Elliot Burke · Goleta, US
• Adam E. Norton · Palo Alto, US

Key dates

• Filing date: Mar 26, 2003
• Grant date: Jul 19, 2005
• Expiry date: Mar 26, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L22/12
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

This invention is an apparatus for imaging metrology, which in particular embodiments may be integrated with a processor station such that a metrology station is apart from but coupled to a process station. The metrology station is provided with a first imaging camera with a first field of view containing the measurement region. Alternate embodiments include a second imaging camera with a second field of view. Preferred embodiments comprise a broadband ultraviolet light source, although other embodiments may have a visible or near infrared light source of broad or narrow optical bandwidth. Embodiments including a broad bandwidth source typically include a spectrograph, or an imaging spectrograph. Particular embodiments may include curved, reflective optics or a measurement region wetted by a liquid. In a typical embodiment, the metrology station and the measurement region are configured to have 4 degrees of freedom of movement relative to each other.