Clip-type lead frame for source mounted die
US6924175B2 · kind B2 · utility
3Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2004 |
| Grant date | Aug 2, 2005 |
| Priority date | — |
| Expiry date | Feb 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a lead frame having a displaced integral strap which is cupped out of a lead frame plane to provide a nest that receives a semiconductor chip electrically connected to an inner surface of the cupped strap. The semiconductor package further has a housing molded over and encapsulating the semiconductor chip with the frame such that a surface of the semiconductor chip facing away from the cupped strip is flush with or protrudes beyond a bottom of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.