Tim Sammon
9Patents
5h-index
6Co-inventors
48Inventor score
Filing activity: Feb 9, 2001 → Jul 15, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6653740B2 | Vertical conduction flip-chip device with bump contacts on single surface | Electricity | 94 | Expired |
| US6593622B2 | Power mosfet with integrated drivers in a common package | Electricity | 59 | Expired |
| US6717260B2 | Clip-type lead frame for source mounted die | Electricity | 16 | Expired |
| US6433424B1 | Semiconductor device package and lead frame with die overhanging lead frame pad | Electricity | 10 | Expired |
| US7034344B2 | Integrated semiconductor power device for multiple battery systems | Electricity | 7 | Expired |
| US7274100B2 | Battery protection circuit with integrated passive components | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6894397B2 | Plural semiconductor devices in monolithic flip chip | Electricity | 4 | Expired |
| US6924175B2 | Clip-type lead frame for source mounted die | Electricity | 3 | Expired |
| USRE41719E1 | Power MOSFET with integrated drivers in a common package | General | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.