Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure
US6930388B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2001 |
| Grant date | Aug 16, 2005 |
| Priority date | — |
| Expiry date | Jul 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided which enables a flip chip connection without use of underfill. The semiconductor device includes a semiconductor element having circuit electrodes and a circuit surface coated with a protecting film. A stress relaxation layer is provided by coating a cured thermoplastic resin onto the protecting film of the circuit surface in a manner which leaves the circuit electrodes exposed and curing it and having an inclination in the edge portion thereof. A wiring layer with wirings is connected to each of the circuit electrodes and disposed so as to make an electrical connection from the circuit electrodes, via the edge portion of the stress relaxation layer, and to a desired portion on the surface of the stress relaxation layer. A protecting film is provided thereon, and an external connection terminal is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.