Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module

US6940156B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Michael Bauer · Nittendorf, DE
• Christian Birzer · Burglengenfeld, DE
• Gerald Ofner · Regensburg, DE
• Stephan Stoeckl · Schwandorf, DE

Key dates

• Filing date: Sep 29, 2003
• Grant date: Sep 6, 2005
• Expiry date: Sep 29, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/351
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic module contains a semiconductor chip that has flexible chip contacts. The flexible chip contacts are disposed on an uppermost metallization layer and have a dimensionally stable contact plate which is connected to contact surfaces on the uppermost metallization layer via electrically conductive components in an elastomeric embedding compound.