Patent · US Expired

Technique for monitoring the state of metal lines in microstructures

US6953755B2 · kind B2 · utility

3Cited by

2References

47Claims

0Family size

Assignee

Advanced Micro Devices, Inc. · US

Inventors

Moritz Andreas Meyer · Pulheim, DE
Ehrenfried Zschech · Radebeul, DE
Eckhard Langer · Radebeul, DE

Key dates

Filing date	Oct 2, 2003
Grant date	Oct 11, 2005
Priority date	—
Expiry date	Nov 25, 2023

Classification

Technology area (CPC G)Physics
CPC primaryG01N2223/076
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

By preparing fully-embedded interconnect structure samples for a cross-section analysis by means of electron microscopy or x-ray microscopy, degradation mechanisms may be efficiently monitored. Moreover, displaying some of the measurement results as a quick motion representation enables the detection of subtle changes of characteristics of an interconnect structure in a highly efficient manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.