Patent · US Expired

Electronic component with at least one semiconductor chip and method for its manufacture

US6953992B2 · kind B2 · utility

1Cited by

6References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Bernd Goller · Otterfing, DE
Robert-Christian Hagen · Sarching, DE
Gerald Ofner · Regensburg, DE
Christian Stumpfl · Wels, AT
Josef Thumbs · Johanngeorgenstadt, DE
Stefan Wein · Regensburg, DE
Holger Wörner · Regensburg, DE

Key dates

Filing date	Sep 20, 2002
Grant date	Oct 11, 2005
Priority date	—
Expiry date	Dec 15, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to an electronic component having at least one semiconductor chip and a flat chip carrier assigned to the semiconductor chip. Electrical connections between contact areas on an active chip surface of the semiconductor chip and contact terminal areas on an upper side of the chip carrier are formed by strips of material that can undergo microstructuring and that are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.