Method for joining a silicon plate to a second plate

US6955975B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Frank Reichenbach · Wannweil, DE
• Frank Fischer · Mesa, US
• Ralf Hausner · Reutlingen, DE
• Frieder Haag · Wannweil, DE
• Eckhard Graf · Gomaringen, DE
• Markus Lutz · Palo Alto, US

Key dates

• Filing date: Sep 5, 2002
• Grant date: Oct 18, 2005
• Expiry date: Sep 16, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12042
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A method for joining a silicon plate to a second plate, a laser beam being directed through the silicon plate at the second plate. In the process, the wavelength of the laser beam is selected in such a way that only a negligibly small amount of energy is absorbed in the silicon plate. A strongly absorbent material is hotmelted by the laser beam's energy and then produces a bond between the silicon plate and the second plate.