Shadow frame with cross beam for semiconductor equipment
US6960263B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2002 |
| Grant date | Nov 1, 2005 |
| Priority date | — |
| Expiry date | Apr 26, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4586
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A shadow frame and framing system for semiconductor fabrication equipment comprising a rectangular frame having four edges, the edges forming an interior lip with a top surface and an bottom engagement surface; and a cross beam disposed between at least two edges of the frame, the cross beam having a top surface and a bottom engagement surface, the engagement surface of the cross beam configured to be flush with the engagement surface of the lip; wherein one or more of the engagement surfaces are configured to cover metal interconnect bonding areas on a carrier disposed below the frame. The shadow frame is particularly useful in plasma enhanced chemical vapor deposition (PECVD) applications used to make active matrix liquid crystal displays (AMLCDs) and solar cells.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.