Reinforced bond pad
US6960836B2 · kind B2 · utility
6Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2003 |
| Grant date | Nov 1, 2005 |
| Priority date | — |
| Expiry date | Oct 12, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.