Method for making a stacked comprising a thin film adhering to a target substrate
US6974759B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2001 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | Dec 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76256
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for manufacturing a stacked structure comprising at least one thin layer bonding to a target substrate, comprising the following steps:a) formation of a thin layer starting from an initial substrate, the thin layer having a free face called the first contact face,b) putting the first contact face into bonding contact with a face of an intermediate support, the structure obtained being compatible with later thinning of the initial substrate,c) thinning of the said initial substrate to expose a free face of the thin layer called the second contact face and opposite the first contact face,d) puffing a face of the target substrate into bonding contact with at least part of the second contact face, the structure obtained being compatible with later removal of all or some of the intermediate support,e) removal of at least part of the intermediate support in order to obtain the said stacked structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.