Apparatus for reducing compressed dry air usage during chemical mechanical planarization
US6976906B2 · kind B2 · utility
3Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2003 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Jan 12, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical planarization (CMP) system is provided. The system includes a polishing surface and a platen disposed along an underside of the polishing surface. A retaining ring surrounds the platen. The retaining ring includes a lower annular sleeve and an upper annular sleeve moveably disposed over the lower annular sleeve. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.