Patent · US Expired

Matching data related to multiple metrology tools

US6978189B1 · kind B1 · utility

9Cited by
1References
34Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 28, 2002
Grant dateDec 20, 2005
Priority date
Expiry dateNov 14, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67253
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method and an apparatus for matching data related to an integrated metrology tool and a standalone metrology tool. At least one semiconductor wafer is processed. An integrated metrology tool and/or a standalone metrology tool is matched based upon a difference between metrology data relating to a processed semiconductor wafer acquired by the integrated metrology tool and metrology data acquired by the standalone metrology tool, using a controller.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.