Conductive polishing article for electrochemical mechanical polishing
US6979248B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2002 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Nov 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/902
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations and a plurality of grooves may be formed in the articles to facilitate flow of material through and around the polishing article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.