Method for modulating shapes of substrates
US6980282B2 · kind B2 · utility
43Cited by
123References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2002 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Dec 11, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70875
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention is directed to a method for modulating shapes of a substrate, having first and second opposed surfaces. This is achieved by creating a pressure differential between differing regions of the first opposed surface to attenuate structural distortions in the second opposed surface that results from external forces bearing on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.