Chucking system for modulating shapes of substrates
US6982783B2 · kind B2 · utility
22Cited by
50References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2004 |
| Grant date | Jan 3, 2006 |
| Priority date | — |
| Expiry date | Jun 9, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/5841
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.