Conformal barrier liner in an integrated circuit interconnect
US6989604B1 · kind B1 · utility
21Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2003 |
| Grant date | Jan 24, 2006 |
| Priority date | — |
| Expiry date | Oct 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/1089
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit having a substrate and a semiconductor device thereon. A stop layer over the substrate has a first dielectric layer formed thereon having an opening into which a first conformal barrier is formed. A first conformal barrier liner is formed in the opening, processed, and treated to improve adhesion. Portions of the first conformal barrier liner on the sidewalls act as a barrier to diffusion of conductor core material to the first dielectric layer. A conductor material is formed in the opening over the vertical portions of the first conformal barrier liner and the first stop layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.