Using external radiators with electroosmotic pumps for cooling integrated circuits

US6992381B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Sarah Kim · Portland, US
• R. Scott List · Beaverton, US
• James G. Maveety · San Jose, US
• Alan M. Myers · Portland, US
• Quat Vu · Santa Clara, US
• Ravi Prasher · Phoenix, US
• Ravi Mahajan · Tempe, US
• Gilroy Vandentop · Tempe, US

Key dates

• Filing date: Oct 31, 2003
• Grant date: Jan 31, 2006
• Expiry date: Mar 5, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/82
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.