Methods for fabricating routing elements for multichip modules
US6995043B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2002 |
| Grant date | Feb 7, 2006 |
| Priority date | — |
| Expiry date | Nov 18, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A routing element for use with a multichip module that includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a multichip module substrate. The conductive traces may be carried upon a single surface of the routing element substrate, be carried internally by the routing element substrate, or include externally and internally carried portions. The routing element also includes a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multichip module. Multichip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.