Apparatus and associated method for conditioning in chemical mechanical planarization
US7004825B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2003 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Sep 29, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A conditioning apparatus for use in a CMP system is provided along with an associated method of operation. The conditioning apparatus includes rotation mechanics and oscillation mechanics. The rotation mechanics are capable of rotating a shaft which causes a holder and a conditioning substrate to be rotated. The oscillation mechanics are capable of moving a position of the shaft within a region defined by a peripheral boundary that is less than and within an outer periphery of the conditioning substrate. A conditioning substrate backing is also included in the conditioning apparatus. The conditioning substrate backing defines a differential pressure distribution that is capable of being applied to the conditioning substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.