Apparatus for electro chemical deposition
US7005046B2 · kind B2 · utility
1Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2002 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Dec 24, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.