Article for polishing semiconductor substrates
US7014538B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2003 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Mar 5, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for using fixed abrasive polishing pads that contain posts for chemical mechanical polishing (CMP). The posts have different shapes, different sizes, different heights, different materials, different distribution of abrasive particles and different process chemicals. This invention also includes preconditioning fixed abrasive articles comprising a plurality of posts so that the posts have equal heights above the backing to achieve a uniform texture. This invention relates to improvements with respect to in situ rate measurement (ISRM) devices. The invention resides in providing a mechanical means, such as a notch, to determine when approaching the end of the abrasive web roll. The invention resides in coding the web throughout its length to enable determining the location of different portions of the web. This invention resides in providing perforations in the sides or end of the web for improved handling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.