Die encapsulation using a porous carrier
US7015075B2 · kind B2 · utility
173Cited by
13References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2004 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Aug 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for encapsulating an integrated circuit die (403) using a porous carrier (101). In one example, an adhesive structure (e.g. tape) is applied to a porous carrier. Integrated circuit die is then placed on the adhesive structure. The integrated circuit die is then encapsulated to form an encapsulated structure (505). The carrier is then subjected to a solvent that passes through the carrier to reduce the adhesive strength of the adhesive structure for removal of the carrier from the encapsulated structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.