Craig Amrine
20Patents
11h-index
33Co-inventors
71Inventor score
Filing activity: May 20, 1996 → Nov 6, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7015075B2 | Die encapsulation using a porous carrier | Electricity | 173 | Expired |
| US6953985B2 | Wafer level MEMS packaging | Electricity | 76 | Expired |
| US7405102B2 | Methods and apparatus for thermal management in a multi-layer embedded chip structure | Electricity | 54 | Active |
| US5717287A | Spacers for a flat panel display and method | Electricity | 53 | Expired |
| US7442581B2 | Flexible carrier and release method for high volume electronic package fabrication | Electricity | 47 | Expired |
| US7741151B2 | Integrated circuit package formation | Electricity | 36 | Active |
| US5708325A | Display spacer structure for a field emission device | Electricity | 26 | Expired |
| US5945780A | Node plate for field emission display | Electricity | 18 | Expired |
| US6149484A | Method of making field emission display having a mechanical support/getter assembly | Electricity | 15 | Expired |
| US5980346A | Method for fabricating a display spacer assembly | Electricity | 13 | Expired |
| US5894193A | Field emission display with getter frame and spacer-frame assembly | Electricity | 11 | Expired |
| US6459198B1 | Seal and method of sealing devices such as displays | Electricity | 7 | Expired |
| US7969026B2 | Flexible carrier for high volume electronic package fabrication | Electricity | 6 | Active |
| US5990613A | Field emission device having a non-coated spacer | Electricity | 4 | Expired |
| US6366009B1 | Method for fabricating a field emission display having a spacer with a passivation layer | Electricity | 3 | Expired |
| US6042445A | Method for affixing spacers in a field emission display | Electricity | 3 | Expired |
| US9142434B2 | Method for singulating electronic components from a substrate | Electricity | 2 | Active |
| US6114802A | Field emission device having stamped substrate and method | Electricity | 2 | Expired |
| US8236609B2 | Packaging an integrated circuit die with backside metallization | Electricity | 2 | Active |
| US7802359B2 | Electronic assembly manufacturing method | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.