End-point detection apparatus
US7029369B2 · kind B2 · utility
4Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Dec 30, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus is provided for polishing a substrate. The apparatus includes a polishing pad configured to traverse from at least a first point to a second point. A first sensor is located near the first point and oriented so as to sense an incoming temperature of the polishing pad. A second sensor is located near the second point and oriented so as to sense an outgoing temperature of the polishing pad. A difference between the incoming temperature and the outgoing temperature is then used to determine endpoint of a polishing operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.