Method and structures for implementing impedance-controlled coupled noise suppressor for differential interface solder column array
US7036710B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2004 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Dec 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and structures are provided for implementing an impedance-controlled coupled noise suppressor for a differential interface solder column array used to join a substrate to a circuit card. The impedance-controlled coupled noise suppressor structure includes a plurality of elongated through openings that are arranged in a predefined pattern with one or more of the through openings receiving a differential signal pair of solder columns. The elongated through openings have electrically conductive sidewalls and are electrically connected together. The predefined pattern of the elongated, electrically conductive through openings corresponds to a layout of solder columns. The solder columns are attached at opposite ends to a substrate and a circuit card. An electrical connection is provided between the impedance-controlled coupled noise suppressor structure and an image return current path of the circuit card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.