Integrated circuit package with low modulus layer and capacitor/interposer
US7042077B2 · kind B2 · utility
19Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2004 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Jun 11, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system may include a coreless substrate, a layer of material attached to the substrate, the layer of material having a lower elastic modulus than the substrate, an interposer coupled to the layer of material, and a capacitive layer coupled to the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.