Edge roughness measurement in optical metrology
US7046375B2 · kind B2 · utility
23Cited by
3References
46Claims
0Family size
Assignee
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Key dates
| Filing date | May 2, 2003 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Apr 28, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/303
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Edge roughness and deterministic profile of a structure formed on a semiconductor wafer are measured using optical metrology by directing an incident beam on the structure using a source and receiving the diffracted beam from the structure using a detector. The received diffracted beam is processed using a processor to determine a deterministic profile of the structure and to measure an edge roughness of the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.