Integrating tool, module, and fab level control
US7047099B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2002 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Jun 18, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor wafers are processed in a fab in a manner that integrates control at multiple functional unit levels. Examples of functional units include fabs, modules, tools, and the like. Initially, a number of functional unit property targets are received at a functional unit. The functional unit property targets are utilized to generate a number of tool targets for any number of tool level functional units. From there, the tool targets are forwarded to the corresponding tool level functional units. At these tool level functional units, a number of tool recipes, each of which define a number of process setpoints, may be generated by processing the tool targets. The process setpoints define a number of parameters which must be satisfied in order to attain the corresponding tool targets. In addition, in at least some embodiments, the tool targets and tool recipes are determined utilizing feedback information including functional unit states and measurements of controlled parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.