Holding unit, processing apparatus and holding method of substrates
US7055535B2 · kind B2 · utility
23Cited by
14References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2003 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Jul 30, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.