Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
US7056806B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2003 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Feb 6, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45546
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure provides methods and apparatus useful in depositing materials on batches of microfeature workpieces. One implementation provides a method in which a quantity of a first precursor gas is introduced to an enclosure at a first enclosure pressure. The pressure within the enclosure is reduced to a second enclosure pressure while introducing a purge gas at a first flow rate. The second enclosure pressure may approach or be equal to a steady-state base pressure of the processing system at the first flow rate. After reducing the pressure, the purge gas flow may be increased to a second flow rate and the enclosure pressure may be increased to a third enclosure pressure. Thereafter, a flow of a second precursor gas may be introduced with a pressure within the enclosure at a fourth enclosure pressure; the third enclosure pressure is desirably within about 10 percent of the fourth enclosure pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.