Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks
US7061124B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2004 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Sep 7, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The solder may be positioned or formed on the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive excess adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.