Conductive polishing article for electrochemical mechanical polishing
US7066800B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2001 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Dec 27, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.