Flip-chip type quad flat package and leadframe
US7067904B2 · kind B2 · utility
6Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2004 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Nov 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip type quad flat package and a leadframe. The leadframe comprises a bump-connecting area and a non-connecting area. The maximum width of the bump-connecting area is larger than the width of the non-connecting area. A bump is limited to the bump-connecting area after performing a reflow process so that the bumps are prevented from collapsing, the manufacturing cost is reduced and the process is simplified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.