Pad assembly for electrochemical mechanical processing
US7077721B2 · kind B2 · utility
14Cited by
222References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2003 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Mar 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32125
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.