Circuitized substrate
US7078816B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2004 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Jul 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer. An electrical assembly and a method of making the substrate is also provided, as is a circuitized structure including the circuitized substrate in combination with other circuitized substrates having lesser dense thru-hole patterns. An information handling system incorporating the circuitized substrate of the invention as part thereof is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.