Patent · US Expired

Substrate removal from polishing tool

US7081042B2 · kind B2 · utility

16Cited by

10References

21Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Hung Chih Chen · San Jose, US
Steven M. Zuniga · Soquel, US
Tsz-Sin Siu · Kwai Chung, CN

Key dates

Filing date	Dec 2, 2004
Grant date	Jul 25, 2006
Priority date	—
Expiry date	Dec 2, 2024

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/30
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Techniques for removing a substrate from a polishing pad are described. A substrate is pulled away from the polishing pad such that the edges of the substrate are pulled away from the polishing pad before the center of the substrate is pulled from the polishing pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.