Microelectronic assemblies having low profile connections
US7098074B2 · kind B2 · utility
3Cited by
10References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2003 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | Oct 31, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.