Chemical mechanical polishing apparatus with rotating belt
US7104875B2 · kind B2 · utility
7Cited by
40References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2004 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | May 3, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.